Degassing Module
Degassing Module
Chemical solution used
Chemical solution used
Organic solvents such as P.R, solvent, diluent, IPA, organic developer, etc.
· Process
- Development process : Bubbles may be placed on the pattern or contact hole, resulting in poor development.
- Application process : Microbubbles during the transfer process of photo resist, thinner, solvent, etc. cause process problems.
- Cleaning process : Bubbles in the ultrapure chemical solution inhibit the cleaning effect on the wafer surface and prevent the formation of an oxide film.
· Flow
Advantages of Crevalpia Degassing Module
Advantages of Crevalpia Degassing Module
| Division | CREVALPIA | Another Company |
| Sleeve |  |
 |
| Fusion method | Heat fusion method | Bonding method |
| Leak performance | Very excellent | Great |
| Productivity | Ease | Difficult |
| Production process | Process simplicity | Process complexity |
| Tube peeling | Very resistant to hammering | Weak to Hammering |
| Reliability | Very good long-term reliability | Long-term reliability is weak |
